Yes you heard it right, OK after I posted my last lapping attempt, I went for another one on Last friday, because the last time some of the Nickel coating still remained intact on the IHS, so I lapped it all off till theres only the copper surface left and this time Polished it with a 2500Grit Sand paper for a Mirror finsih, lapped the HSF again, when I set things up again, the temps have gone about 2~3C lower than the last time, and it remained like that for the last few days, 30Mins in OCCT CPU test would result in a 72~73C T-Junction Temp, But today for my surprise the Temps never Reached 70 at all (considering OCCT can heat a CPU up quite bit more than Prime 95). I think this is what is called the Setting of TIM, when the CPU heats the Copper would expand and the thermal Interface Material creeps inside the small cracks and mircroscopic scratches of both IHS and HSF, this takes some time to completely set, the result is even lower temps. if you dont care about the warrenty of your CPU and if you are in to a lot of over clocking I cannot Stress more that U MUST LAP your CPU and HSF.
Heres a screen shot I have taken Today while running OCCT CPU test for 30Minutes.
Heres a screen shot I have taken Today while running OCCT CPU test for 30Minutes.
.dats y we r asking lyke diz bro
