VIA Technologies, a leading innovator of power efficient x86 processor platforms, today announced the launch of VIA's first embedded box computer; the VIA AMOS-3000. Ideal for a variety of embedded applications, the VIA AMOS-3000 is a robust, custom-designed system based on the ultra compact and versatile VIA EPIA-P700 Pico-ITX board. Inspired by classical Chinese architecture, the VIA AMOS-3000 chassis combines heavy-duty steel, aluminum and copper in a unique heat fin design that offers superb heat dissipation. Using a total of only five mechanical pieces - top cover, bottom plate, front and rear I/O access plates and DOM module - and measuring only 13.5cm(w) x 4.5cm(h) x 13.1cm(d), the VIA AMOS-3000 is strong, durable and heat efficient, yet tiny enough to fit in the palm of your hand.
